2023-12-05
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CVE-2023-33042
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Transient DOS in Modem after RRC Setup message is received.
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315_5g_iot_modem_firmware, Ar8035_firmware, Qca6390_firmware, Qca6391_firmware, Qca6421_firmware, Qca6426_firmware, Qca6431_firmware, Qca6436_firmware, Qca6574a_firmware, Qca6595au_firmware, Qca6696_firmware, Qca6698aq_firmware, Qca8081_firmware, Qca8337_firmware, Qcm6490_firmware, Qcn6024_firmware, Qcn9024_firmware, Qcs6490_firmware, Qcs8550_firmware, Qualcomm_video_collaboration_vc3_platform_firmware, Sd855_firmware, Sd865_5g_firmware, Sd888_firmware, Sdx55_firmware, Sdx57m_firmware, Sm4350\-Ac_firmware, Sm4350_firmware, Sm4375_firmware, Sm6350_firmware, Sm6375_firmware, Sm7225_firmware, Sm7250\-Aa_firmware, Sm7250\-Ab_firmware, Sm7250\-Ac_firmware, Sm7250p_firmware, Sm7315_firmware, Sm7325\-Ae_firmware, Sm7325\-Af_firmware, Sm7325_firmware, Sm7325p_firmware, Sm7350\-Ab_firmware, Sm8150\-Ac_firmware, Sm8250\-Ab_firmware, Sm8250\-Ac_firmware, Sm8250_firmware, Sm8350\-Ac_firmware, Sm8450_firmware, Sm8475_firmware, Snapdragon_7c\+_gen_3_compute_firmware, Snapdragon_auto_5g_modem\-Rf_firmware, Snapdragon_x55_5g_modem\-Rf_system_firmware, Snapdragon_x65_5g_modem\-Rf_system_firmware, Snapdragon_x70_modem\-Rf_system_firmware, Snapdragon_xr2_5g_platform_firmware, Sxr2130_firmware, Wcd9341_firmware, Wcd9360_firmware, Wcd9370_firmware, Wcd9375_firmware, Wcd9380_firmware, Wcd9385_firmware, Wcn3988_firmware, Wcn3991_firmware, Wcn3998_firmware, Wcn6740_firmware, Wcn6750_firmware, Wcn685x\-1_firmware, Wcn685x\-5_firmware, Wcn785x\-1_firmware, Wcn785x\-5_firmware, Wsa8810_firmware, Wsa8815_firmware, Wsa8830_firmware, Wsa8835_firmware
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7.5
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2023-12-05
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CVE-2023-33043
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Transient DOS in Modem when a Beam switch request is made with a non-configured BWP.
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Ar8035_firmware, Qca6391_firmware, Qca8081_firmware, Qca8337_firmware, Qcm4490_firmware, Qcm6490_firmware, Qcm8550_firmware, Qcn6024_firmware, Qcn9024_firmware, Qcs4490_firmware, Qcs6490_firmware, Qcs8550_firmware, Qualcomm_video_collaboration_vc3_platform_firmware, Sd888_firmware, Sdx57m_firmware, Sm4350\-Ac_firmware, Sm4350_firmware, Sm4375_firmware, Sm6375_firmware, Sm7315_firmware, Sm7325\-Ae_firmware, Sm7325\-Af_firmware, Sm7325p_firmware, Sm7350\-Ab_firmware, Sm8350\-Ac_firmware, Sm8350_firmware, Sm8450_firmware, Sm8475_firmware, Sm8550p_firmware, Snapdragon_4_gen_2_mobile_platform_firmware, Snapdragon_7c\+_gen_3_compute_firmware, Snapdragon_8\+_gen_2_mobile_platform_firmware, Snapdragon_8_gen_2_mobile_platform_firmware, Snapdragon_x65_5g_modem\-Rf_system_firmware, Snapdragon_x70_modem\-Rf_system_firmware, Wcd9370_firmware, Wcd9375_firmware, Wcd9380_firmware, Wcd9385_firmware, Wcd9390_firmware, Wcd9395_firmware, Wcn3950_firmware, Wcn3988_firmware, Wcn3991_firmware, Wcn3998_firmware, Wcn6740_firmware, Wcn6750_firmware, Wcn685x\-1_firmware, Wcn685x\-5_firmware, Wcn785x\-1_firmware, Wcn785x\-5_firmware, Wsa8810_firmware, Wsa8815_firmware, Wsa8830_firmware, Wsa8832_firmware, Wsa8835_firmware, Wsa8840_firmware, Wsa8845_firmware, Wsa8845h_firmware
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7.5
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2023-12-05
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CVE-2023-33044
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Transient DOS in Data modem while handling TLB control messages from the Network.
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315_5g_iot_modem_firmware, Ar8035_firmware, Qca6390_firmware, Qca6391_firmware, Qca6421_firmware, Qca6426_firmware, Qca6431_firmware, Qca6436_firmware, Qca6574a_firmware, Qca6574au_firmware, Qca6595au_firmware, Qca6696_firmware, Qca6698aq_firmware, Qca8081_firmware, Qca8337_firmware, Qcm4490_firmware, Qcm6490_firmware, Qcm8550_firmware, Qcn6024_firmware, Qcn9024_firmware, Qcs4490_firmware, Qcs6490_firmware, Qcs8550_firmware, Qualcomm_video_collaboration_vc3_platform_firmware, Sd855_firmware, Sd865_5g_firmware, Sd888_firmware, Sdx55_firmware, Sdx57m_firmware, Sm4350\-Ac_firmware, Sm4350_firmware, Sm4375_firmware, Sm6350_firmware, Sm6375_firmware, Sm7225_firmware, Sm7250\-Aa_firmware, Sm7250\-Ab_firmware, Sm7250\-Ac_firmware, Sm7250p_firmware, Sm7315_firmware, Sm7325\-Ae_firmware, Sm7325\-Af_firmware, Sm7325_firmware, Sm7325p_firmware, Sm7350\-Ab_firmware, Sm8150\-Ac_firmware, Sm8250\-Ab_firmware, Sm8250\-Ac_firmware, Sm8250_firmware, Sm8350\-Ac_firmware, Sm8350_firmware, Sm8450_firmware, Sm8475_firmware, Sm8550p_firmware, Snapdragon_4_gen_2_mobile_platform_firmware, Snapdragon_7c\+_gen_3_compute_firmware, Snapdragon_8\+_gen_2_mobile_platform_firmware, Snapdragon_8_gen_2_mobile_platform_firmware, Snapdragon_auto_5g_modem\-Rf_firmware, Snapdragon_x55_5g_modem\-Rf_system_firmware, Snapdragon_x65_5g_modem\-Rf_system_firmware, Snapdragon_x70_modem\-Rf_system_firmware, Snapdragon_xr2_5g_platform_firmware, Sxr2130_firmware, Wcd9341_firmware, Wcd9360_firmware, Wcd9370_firmware, Wcd9375_firmware, Wcd9380_firmware, Wcd9385_firmware, Wcd9390_firmware, Wcd9395_firmware, Wcn3950_firmware, Wcn3988_firmware, Wcn3991_firmware, Wcn3998_firmware, Wcn6740_firmware, Wcn6750_firmware, Wcn685x\-1_firmware, Wcn685x\-5_firmware, Wcn785x\-1_firmware, Wcn785x\-5_firmware, Wsa8810_firmware, Wsa8815_firmware, Wsa8830_firmware, Wsa8832_firmware, Wsa8835_firmware, Wsa8840_firmware, Wsa8845_firmware, Wsa8845h_firmware
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7.5
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2023-12-05
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CVE-2023-33079
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Memory corruption in Audio while running invalid audio recording from ADSP.
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Apq5053\-Aa_firmware, Ar8035_firmware, Csra6620_firmware, Csra6640_firmware, Flight_rb5_5g_platform_firmware, Qam8255p_firmware, Qam8295p_firmware, Qam8650p_firmware, Qam8775p_firmware, Qca6390_firmware, Qca6391_firmware, Qca6426_firmware, Qca6436_firmware, Qca6574_firmware, Qca6574a_firmware, Qca6574au_firmware, Qca6584au_firmware, Qca6595_firmware, Qca6595au_firmware, Qca6696_firmware, Qca6698aq_firmware, Qca6797aq_firmware, Qca8081_firmware, Qca8337_firmware, Qcc710_firmware, Qcm2290_firmware, Qcm4290_firmware, Qcm4325_firmware, Qcm5430_firmware, Qcm6490_firmware, Qcm8550_firmware, Qcn6224_firmware, Qcn6274_firmware, Qcn9011_firmware, Qcn9012_firmware, Qcs2290_firmware, Qcs410_firmware, Qcs4290_firmware, Qcs5430_firmware, Qcs610_firmware, Qcs6490_firmware, Qcs7230_firmware, Qcs8250_firmware, Qcs8550_firmware, Qfw7114_firmware, Qfw7124_firmware, Qm215_firmware, Qrb5165_firmware, Qrb5165m_firmware, Qrb5165n_firmware, Qualcomm_video_collaboration_vc1_platform_firmware, Qualcomm_video_collaboration_vc3_platform_firmware, Qualcomm_video_collaboration_vc5_platform_firmware, Sa4150p_firmware, Sa4155p_firmware, Sa6145p_firmware, Sa6150p_firmware, Sa6155p_firmware, Sa8145p_firmware, Sa8150p_firmware, Sa8155p_firmware, Sa8195p_firmware, Sa8255p_firmware, Sa8295p_firmware, Sa8770p_firmware, Sa8775p_firmware, Sa9000p_firmware, Sd660_firmware, Sd865_5g_firmware, Sd888_firmware, Sg4150p_firmware, Sg8275p_firmware, Sm4125_firmware, Sm4250\-Aa_firmware, Sm4350\-Ac_firmware, Sm4375_firmware, Sm6225\-Ad_firmware, Sm6225_firmware, Sm6350_firmware, Sm6375_firmware, Sm7225_firmware, Sm7250\-Aa_firmware, Sm7250\-Ab_firmware, Sm7250\-Ac_firmware, Sm7250p_firmware, Sm7315_firmware, Sm7325\-Ae_firmware, Sm7325\-Af_firmware, Sm7325_firmware, Sm7325p_firmware, Sm7350\-Ab_firmware, Sm8250\-Ab_firmware, Sm8250\-Ac_firmware, Sm8250_firmware, Sm8350\-Ac_firmware, Sm8350_firmware, Sm8550p_firmware, Snapdragon_662_mobile_platform_firmware, Snapdragon_7c\+_gen_3_compute_firmware, Snapdragon_8\+_gen_2_mobile_platform_firmware, Snapdragon_8_gen_2_mobile_platform_firmware, Snapdragon_auto_5g_modem\-Rf_firmware, Snapdragon_auto_5g_modem\-Rf_gen_2_firmware, Snapdragon_w5\+_gen_1_wearable_platform_firmware, Snapdragon_x55_5g_modem\-Rf_system_firmware, Snapdragon_x75_5g_modem\-Rf_system_firmware, Snapdragon_xr2\+_gen_1_platform_firmware, Snapdragon_xr2_5g_platform_firmware, Sw5100_firmware, Sw5100p_firmware, Sxr2130_firmware, Wcd9326_firmware, Wcd9335_firmware, Wcd9340_firmware, Wcd9341_firmware, Wcd9370_firmware, Wcd9375_firmware, Wcd9380_firmware, Wcd9385_firmware, Wcd9390_firmware, Wcd9395_firmware, Wcn3615_firmware, Wcn3660b_firmware, Wcn3680b_firmware, Wcn3910_firmware, Wcn3950_firmware, Wcn3980_firmware, Wcn3988_firmware, Wcn3990_firmware, Wcn3991_firmware, Wcn3998_firmware, Wcn6740_firmware, Wcn6750_firmware, Wcn685x\-1_firmware, Wcn685x\-5_firmware, Wcn785x\-1_firmware, Wcn785x\-5_firmware, Wsa8810_firmware, Wsa8815_firmware, Wsa8830_firmware, Wsa8835_firmware, Wsa8840_firmware, Wsa8845_firmware, Wsa8845h_firmware
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7.8
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