Product:

Sd_652_firmware

(Qualcomm)
Repositories

Unknown:

This might be proprietary software.
#Vulnerabilities 313
Date Id Summary Products Score Patch Annotated
2018-10-23 CVE-2017-18292 Secure app running in non secure space can restart TZ by calling Widevine app API repeatedly in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A. Msm8909w_firmware, Msm8996au_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_800_firmware, Sd_810_firmware, Sd_820_firmware, Sd_820a_firmware 5.5
2018-10-23 CVE-2017-18172 In a device, with screen size 1440x2560, the check of contiguous buffer will overflow on certain buffer size resulting in an Integer Overflow or Wraparound in System UI in Snapdragon Automobile, Snapdragon Mobile in version MDM9635M, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016. Mdm9635m_firmware, Sd_400_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_427_firmware, Sd_430_firmware, Sd_435_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_800_firmware, Sd_810_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sdm630_firmware, Sdm636_firmware, Sdm660_firmware 7.8
2018-10-23 CVE-2017-18170 Improper input validation in Bluetooth Controller function can lead to possible memory corruption in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SD 850, SDM630, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016. Qca9379_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_427_firmware, Sd_430_firmware, Sd_435_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware, Sdm630_firmware, Sdm636_firmware, Sdm660_firmware, Sdm710_firmware 8.8
2018-04-11 CVE-2017-18146 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, in some corner cases, ECDSA signature verification can fail. Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_400_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_800_firmware, Sd_808_firmware, Sd_810_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware 9.8
2018-04-11 CVE-2017-18145 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while the DPM native process is processing framework events, the iterator pointer is deleted after processing an event. When processing subsequent events, a Use After Condition will occur. Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_415_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware 9.8
2018-04-11 CVE-2017-18144 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing the retransmission of WPA supplicant command send failures, there is a make after break of the connection to WPA supplicant where the local pointer is not properly updated. If the WPA supplicant command transmission fails, a Use After Free condition will occur. Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_415_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware 9.8
2018-04-11 CVE-2017-18140 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free... Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_400_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_808_firmware, Sd_810_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware 9.8
2018-04-11 CVE-2017-18139 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, a buffer overflow vulnerability may potentially exist while making an IMS call. Mdm9206_firmware, Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_400_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_808_firmware, Sd_810_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware 9.8
2018-04-11 CVE-2017-18138 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, in GERAN, a buffer overflow may potentially occur. Mdm9206_firmware, Mdm9607_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_400_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_808_firmware, Sd_810_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware 9.8
2018-04-11 CVE-2017-18137 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9640, MDM9645, MDM9650, MDM9655, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 835, while processing the IPv6 pdp address of the pdp context, a buffer overflow can occur. Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Sd_450_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_810_firmware, Sd_820_firmware, Sd_835_firmware 9.8