Note:
This project will be discontinued after December 13, 2021. [more]
Product:
Sd810_firmware
(Qualcomm)| Repositories |
Unknown: This might be proprietary software. |
| #Vulnerabilities | 7 |
| Date | Id | Summary | Products | Score | Patch | Annotated |
|---|---|---|---|---|---|---|
| 2018-09-20 | CVE-2017-18314 | In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ. | Mdm9206_firmware, Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd410_firmware, Sd412_firmware, Sd415_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd615_firmware, Sd616_firmware, Sd617_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware | 9.8 | ||
| 2018-09-20 | CVE-2018-11982 | In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure. | Mdm9206_firmware, Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd410_firmware, Sd412_firmware, Sd415_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd615_firmware, Sd616_firmware, Sd617_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd810_firmware, Sd820_firmware, Sd835_firmware | 8.8 | ||
| 2018-09-20 | CVE-2018-11291 | In Snapdragon (Automobile, Mobile, Wear) in version IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA4531, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA9377, QCA9378, QCA9379, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, cryptographic issues due to the random number generator was not a strong one in NAN. | Ipq8074_firmware, Mdm9206_firmware, Mdm9607_firmware, Mdm9640_firmware, Mdm9650_firmware, Msm8996au_firmware, Qca4531_firmware, Qca6174a_firmware, Qca6564_firmware, Qca6574_firmware, Qca6574au_firmware, Qca6584_firmware, Qca6584au_firmware, Qca9377_firmware, Qca9378_firmware, Qca9379_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd600_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sd850_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdx20_firmware | 7.5 | ||
| 2018-09-20 | CVE-2018-11285 | In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur. | Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd415_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd615_firmware, Sd616_firmware, Sd625_firmware, Sd650_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdm710_firmware, Sdx20_firmware | 7.8 | ||
| 2018-09-20 | CVE-2018-11277 | In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to... | Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd415_firmware, Sd430_firmware, Sd450_firmware, Sd615_firmware, Sd616_firmware, Sd617_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sda660_firmware | 7.8 | ||
| 2018-09-20 | CVE-2018-11269 | In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | Mdm9206_firmware, Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sd850_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdm710_firmware, Sdx20_firmware | 7.8 | ||
| 2018-09-20 | CVE-2018-11268 | In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | Mdm9206_firmware, Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sd850_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdm710_firmware, Sdx20_firmware | 7.8 |