Note:
This project will be discontinued after December 13, 2021. [more]
Product:
Sd415_firmware
(Qualcomm)| Repositories |
Unknown: This might be proprietary software. |
| #Vulnerabilities | 7 |
| Date | Id | Summary | Products | Score | Patch | Annotated |
|---|---|---|---|---|---|---|
| 2018-09-20 | CVE-2018-11292 | In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer & heap overflows. | Mdm9206_firmware, Mdm9607_firmware, Mdm9640_firmware, Mdm9650_firmware, Msm8909w_firmware, Msm8996au_firmware, Qca6574au_firmware, Qca6584_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd410_firmware, Sd412_firmware, Sd415_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd450_firmware, Sd615_firmware, Sd616_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd820a_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware | 7.8 | ||
| 2018-09-20 | CVE-2017-18314 | In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ. | Mdm9206_firmware, Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd410_firmware, Sd412_firmware, Sd415_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd615_firmware, Sd616_firmware, Sd617_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware | 9.8 | ||
| 2018-09-20 | CVE-2018-5871 | In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests (for privacy reasons) is not done properly due to a flawed RNG which produces repeating output much... | Mdm9206_firmware, Mdm9607_firmware, Mdm9640_firmware, Mdm9650_firmware, Msm8996au_firmware, Qca6574au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd415_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd615_firmware, Sd616_firmware, Sd650_firmware, Sd652_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sd850_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdm710_firmware | 6.5 | ||
| 2018-09-20 | CVE-2018-11982 | In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure. | Mdm9206_firmware, Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd410_firmware, Sd412_firmware, Sd415_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd615_firmware, Sd616_firmware, Sd617_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd810_firmware, Sd820_firmware, Sd835_firmware | 8.8 | ||
| 2018-09-20 | CVE-2018-11285 | In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur. | Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd415_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd615_firmware, Sd616_firmware, Sd625_firmware, Sd650_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdm710_firmware, Sdx20_firmware | 7.8 | ||
| 2018-09-20 | CVE-2018-11277 | In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to... | Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd415_firmware, Sd430_firmware, Sd450_firmware, Sd615_firmware, Sd616_firmware, Sd617_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sda660_firmware | 7.8 | ||
| 2018-09-20 | CVE-2018-11267 | In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region... | Mdm9206_firmware, Mdm9607_firmware, Mdm9615_firmware, Mdm9640_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd410_firmware, Sd412_firmware, Sd415_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd600_firmware, Sd615_firmware, Sd616_firmware, Sd617_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sd850_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdx20_firmware, Snapdragon_high_med_2016_firmware | 7.8 |